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Sn-
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有R型、RMA型、RA型规范的三款无铅树脂芯焊锡丝产品供您选择，以适用于不同产品的焊接工艺.
Types R, RMA and RA lead-free resin core solder wires can be chosen to meet the needs of the different processes and products.

不含卤素，焊后残留极少，适用于免清洗工艺流程。
Halogen-free and few post-soldered residuals are suitable for no-cleaning process.

适用于镀Ni、镀Zn件、可伐合金以及杜美丝等难焊母材的钎焊。
Suitable for soldering plating Ni or Zn pieces, Kovar, Dumet parts, which are usually difficult to solder.

应用于水清洗工艺流程，水清洗残液能被生物降解。
Applied to the water cleaning process for water cleaning residue can be biodegraded.

在304、306和1Cr18Ni9Ti不锈钢母材上有良好的钎焊性。
Good solderability on 304,306 and 1Cr18Ni9Ti stainless steel.

用于铝制灯头，铝-铝，铝-铜，吕漆包线的钎焊与铝线搪锡。
Suitable for soldering of aluminum lamp head, aluminum-aluminum, aluminum-copper, enameled aluminum wire as well as aluminum wire of hot dip tinning.

注：以上不同功能的无铅焊锡丝，本公司备有各种合金成分和直径供您选择。
无铅焊锡丝产品执行标准：GB/T20422-2006;ISO9453：1993(E)

Note: The lead-free solder wire has different functions. Our company has a variety of alloy compositions and diameter wires for choosing.
Suitable standard for lead-free solder: GB/T20422-2006/ISO 9453:1993(E)

By means of strict and sound management approaches and quality control methods, our company has been produced high quality lead-free solder bars by using high-purity raw materials. Because advanced alloy melting process and anti-oxidation technology are adopted, the oxides and impurity elements such as Zn, Al, Fe, As, Ca could be effectively reduced to the minimum level. The surface of the joint soldered by our lead-free solder is uniformly bright and beauty, and the solder bars are qualified for good soldering fluidity, excellent wettability and less dross, which can be effectively avoid the emerging of defects of the pull of the soldering tip and bridging joint.
Huayin lead-free solder bars are divided to two types, e.g. low temperature anti-oxidation bar and high temperature anti-oxidation bar which they can offer a variety of alloy compositions choices.

Carried Standard: GB/T 20422-2006

广泛应用于电子产品PCB的波峰焊、热浸焊无铅组装；电子元器件引脚的无铅搪锡；太阳能电池板用互连带汇流带的无铅热涂锡等工艺流程，锡缸工作温度根据不同的钎焊工艺设置在240~300℃间（工作温度<300℃，以保证持久的抗氧化能力与效果）

The bars are widely used in wave soldering, hot dip soldering as well as lead-free mounting and packaging in electronic products and PCB board, tinning in leadless electronic components, solar cell panels with bus interconnect with thermal coated with tin as wellas lead-free process. The working temperature of tin cylinder is depending on the soldering process, which it can be set an 240~300℃(working temperature＜300℃, in order to ensure lasting and anti-oxidant effect.)

高温抗氧化无铅锡条

可用于具有自溶漆包线的直接搪锡，变压器行业的无铅焊接组装；其他高温焊接要求的场合（工作温度＜450℃，以维持高温抗氧化能力）

The bars can be used to directly enamel tin of autolysis of enameled wire, mount and package with lead-free solder in transformer industry. They also can be met the needs of the requirement of other high temperature soldering(temperature is about 450℃, which in order to maintain the high temperature oxidation ability).

Lead-free paste solder is applied in SMT of lead-free fabrication of electronic products, which is made from a special flux, thixotropic agent and lower oxidized lead-free powder solder with excellent continuous printing performance. The lead-free paste solder contains outstanding surfactant with high reliability, fewer residue and high insulation resistance after reflow soldering. The soldered joint is clear, neat and beautiful.Currently, the compositons of lead-free paste solders are Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu and Sn0.3Ag0.7Cu.