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首页 > 产品展示 > 助焊剂系列

无铅用助焊剂

HY-FW201 无铅助焊剂为无色透明或浅黄色亮透液态助焊剂,低固体含量、不含卤素、焊后残留物极少、焊点光亮饱满、PCB板焊后清洁等特点;适用于喷雾、发泡的波峰焊、移动钎焊和热浸焊工艺,是一款为无铅焊接设计的环保型产品。

HY-FW201 lead-free flux is a colorless or light yellow transparent liquid flux with low content of solids, halogen-free, minimal residua after soldering. Matched this flux, the soldered joint presents a full bright spot, on which the PCB board is very clean as soldered. It is suitable for wave soldering with spraying or foaming, moving soldering and hot-dip soldering matching lead-free solders, which is an environment-friendly product.

免清洗助焊剂

适用于高可靠性电子产品PCB组装波峰焊、热浸焊的免清洗工艺流程,具有焊点可靠、美观、清洁、焊后绝缘电阻高、离子污染度低等特点,焊后PCB板无需清洗即达到原信息产业部免清洗液态焊剂技术条件中I级规范、美国 MIL-P-28809标准规范。
产品型号:HY-FN200 免清洗助焊剂

HY-FN200 flux is suitable for high reliability electronic product in which the process could be wave soldering on PCB board, hot dip soldering and no-clean soldering. The soldered joints are qualified for bright, reliable, clean, beautiful, higher insulation resistance, lower ionic contamination, and fewer residua on as-soldered PCB board, which no-clean SMA can meet the demands of related specification with no-clean technology suchas American MIL-P-28809 and China SJ/T 11168-1998.
Model:HY-FN200-clean flux.

树脂型助焊剂

该产品分为高固含量和低固含量二款,型号分别为:HY-FR302(低固含量)、HY-FR305(高固含量)树脂型助焊剂,适用于镀锌件、镀镍件、铍青铜、可伐合金等难焊母材的焊接,应用于热浸焊、手工焊及小型PCB板的手工移动焊接。

Our resin fluxes are divided into high solid content and low-solid content. HY-FR302(low solid content) and HY-FR305(high solid conten) resin flux are suitable for soldering galvanized parts, nickel plated parts, beryllium bronze parts and kovar alloy parts which are difficult to be soldered. They can be used in hot dip soldering, manual soldering and moving soldering on a small PCB board.

水溶性助焊剂

HY-FS 水溶性助焊剂具有上焊速度快、润湿性好、焊后能用水清洗,被应用于各种制程的电子装联、元器件管脚、线材的搪锡工艺。

HY-FS-soluble solder flux is qualified for fast soldering speed, excellent solderability and reliable joint ro be washed with water after soldering, which is widely used in various electronic products, components, pins and wire to be tinned.

VOC-free 助焊剂

为保护人类环境,减少影响温室效应物质(VOC)排放的助焊剂,该助焊剂不含任何易挥发性有机溶剂,从而使您的生产工艺更符合当今环保时代的要求。

This flux is qualified for protecting the human environment and reducing the emission of greenhouse effect substances(VOC), in which no volatile organic solvent existed to meet the requirements of environment production.

不锈钢用助焊剂

适用于304、306、1Cr18Ni9Ti 不锈钢材质的锡铅软钎焊助焊剂,配合 Sn60~Sn63 实心焊锡丝施焊,表现为焊接速度快、焊缝致密、R角一致效果;焊后易用水清洗;国内首创的中性(PH值呈中性)不锈钢助焊剂。

This flux is suitable for soldering stainless steels such as 304, 306 and 1Cr18Ni9Ti matching Sn60~Sn63 solid solder wire, which is qualified for fast soldering speed, dense joint, uniform R angle and reliable joint to be washed with water after soldering. It is a domestic initiative neutral flux(PH value neutral) for soldering stainless steel.